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• Automotive Grade Device, AEC-Q100 Grade 3 Qualified |
• Operating Temperature Range: –40°C to +85°C |
• 20 to 65 MHz Shift Clock Support |
• 50% Duty Cycle on Receiver Output Clock |
• Best–in–Class Set & Hold Times on RxOUTPUTs |
• Rx Power Consumption <142 mW (typ) @65MHz Grayscale |
• Rx Power-down Mode <200μW (max) |
• ESD Rating >7 kV (HBM), >700V (EIAJ) |
• Supports VGA, SVGA, XGA and Dual Pixel SXGA. |
• PLL Requires No External Components |
• Compatible with TIA/EIA-644 LVDS Standard |
• Low Profile 56-Lead TSSOP Package |
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CATALOG |
DS90CF384AQMTX/NOPB COUNTRY OF ORIGIN |
DS90CF384AQMTX/NOPB PARAMETRIC INFO |
DS90CF384AQMTX/NOPB PACKAGE INFO |
DS90CF384AQMTX/NOPB MANUFACTURING INFO |
DS90CF384AQMTX/NOPB PACKAGING INFO |
DS90CF384AQMTX/NOPB ECAD MODEL |
DS90CF384AQMTX/NOPB FUNCTONAL BLOCK DIAGRAM |
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO |
Function |
Receiver |
Number of Drivers |
0 |
Number of Receivers |
4 |
Input Signal Type |
LVCMOS|LVTTL |
Transmission Data Rate (Mbps) |
1800 |
Number of Elements per Chip |
4 |
Minimum Operating Supply Voltage (V) |
3 |
Typical Operating Supply Voltage (V) |
3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Maximum Input Current (uA) |
10 |
Output Signal Type |
LVDS |
Differential Input High Threshold Voltage (V) |
0.1 |
Differential Input Low Threshold Voltage (V) |
-0.1 |
Maximum Power Dissipation (mW) |
1610 |
Minimum Operating Frequency (MHz) |
20 |
Maximum Operating Frequency (MHz) |
65 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO |
Supplier Package |
TSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
56 |
Lead Shape |
Gull-wing |
PCB |
56 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
14.1(Max) |
Package Width (mm) |
6.2(Max) |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
14.1(Max) |
Package Overall Width (mm) |
8.3(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Shrink Small Outline Package |
Package Family Name |
SOP |
Jedec |
MO-153ED |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
X |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Packaging Document |
Link to Datasheet |
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ECAD MODEL |
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FUNCTONAL BLOCK DIAGRAM |
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